<?xml version="1.0" encoding="utf-8" ?> <rss version="2.0" xmlns:opensearch="http://a9.com/-/spec/opensearch/1.1/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom"> <channel> <title> <![CDATA[ Search for 'su:&quot;Engineering--Materials&quot;']]> </title> <link> https://catalog.riphah.edu.pk//cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Engineering--Materials%22&#38;sort_by=relevance&#38;format=rss </link> <atom:link rel="self" type="application/rss+xml" href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Engineering--Materials%22&#38;sort_by=relevance&#38;format=rss"/> <description> <![CDATA[ Search results for 'su:&quot;Engineering--Materials&quot;' at ]]> </description> <opensearch:totalResults>39</opensearch:totalResults> <opensearch:startIndex>0</opensearch:startIndex> <opensearch:itemsPerPage>50</opensearch:itemsPerPage> <atom:link rel="search" type="application/opensearchdescription+xml" href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Engineering--Materials%22&#38;sort_by=relevance&#38;format=opensearchdescription"/> <opensearch:Query role="request" searchTerms="q%3Dccl%3Dsu%253A%2522Engineering--Materials%2522" startPage="" /> <item> <title> Strength of materials </title> <dc:identifier>ISBN:0333144430 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2522</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0333144430.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Ryder, G. H..<br /> London English language book society 1989 .<br /> xii, 340 p. ; 21 cm..<br /> 0333144430 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2522">Place hold on <em>Strength of materials</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2522</guid> </item> <item> <title> Introduction to materials science for engineers </title> <dc:identifier>ISBN:0131804073 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2545</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0131804073.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Shackelford, James F..<br /> New Jersey Prentice Hall 1996 .<br /> xiii, 670 p. , Includes index. ; 26 cm..<br /> 0131804073 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2545">Place hold on <em>Introduction to materials science for engineers </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2545</guid> </item> <item> <title> The science and engineering of materials </title> <dc:identifier>ISBN:0534953735 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2550</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0534953735.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Askeland, Donald R. | Pradeep P. Phule.<br /> Australia Thomson Brooks/Cole 2003 .<br /> xxviii, 1003 p. , Includes index. ; 27 cm..<br /> 0534953735 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2550">Place hold on <em>The science and engineering of materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2550</guid> </item> <item> <title> Materials science and engineering an introduction </title> <dc:identifier>ISBN:0471320137 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2552</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0471320137.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Callister, William D..<br /> New York John Wiley &amp; Sons Inc. 2000 .<br /> xxi, 871 p. , Includes index. ; 26 cm..<br /> 0471320137 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2552">Place hold on <em>Materials science and engineering </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2552</guid> </item> <item> <title> Strength of materials </title> <dc:identifier>ISBN:0063505991 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2603</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0063505991.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Andrew Pytel | Ferdinand L. Singer.<br /> Cambridge Harper &amp; Row 1999 .<br /> xiii, 594 p. , Index Included. ; 21 cm..<br /> 0063505991 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2603">Place hold on <em>Strength of materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2603</guid> </item> <item> <title> Advanced mechanics of materials </title> <dc:identifier>ISBN:0471600091 (pbk) </dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2605</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0471600091.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Boresi, Arthur P. | Richard J. Schmidt | Omar M. Sidebottom .<br /> New York John Wiley &amp; Sons 1993 .<br /> xvii, 811 p. ; 25 cm. .<br /> 0471600091 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2605">Place hold on <em>Advanced mechanics of materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2605</guid> </item> <item> <title> Principles of materials science and engineering </title> <dc:identifier>ISBN:0070592411 (hb) </dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2614</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0070592411.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Smith, William F. .<br /> New York Mc Graw Hill 1996 .<br /> xv, 892 p. ; 24 cm. .<br /> 0070592411 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2614">Place hold on <em>Principles of materials science and engineering </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2614</guid> </item> <item> <title> Engineering problem solving a classical perspective </title> <dc:identifier>ISBN:8124205337 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2663</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8124205337.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Shaw,Milton C..<br /> New Delhi Crest Publishing house 2000 .<br /> xix, 472 p. ; 25 cm..<br /> 8124205337 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2663">Place hold on <em>Engineering problem solving</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2663</guid> </item> <item> <title> Engineering GNVQ intermediate </title> <dc:identifier>ISBN:075062597 X (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2698</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/075062597X.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Bird, John | Bruce Newby | Roger Timings .<br /> Oxford Butterworth Heinemann 1996 .<br /> ix, 422 p. , Includes index ; 26 cm..<br /> 075062597 X (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2698">Place hold on <em>Engineering GNVQ</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2698</guid> </item> <item> <title> Engineering GNVQ advanced </title> <dc:identifier>ISBN:0750625953 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2714</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0750625953.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Mike Tooley (editor).<br /> Boston Butterworth-Heinemann 1996 .<br /> 630 p. ; 26 cm..<br /> 0750625953 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2714">Place hold on <em>Engineering GNVQ</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2714</guid> </item> <item> <title> Workshop technology </title> <dc:identifier>ISBN:0074600265 (pbk) </dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2950</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0074600265.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Bawa, H S .<br /> New Delhi Tata Mc Graw Hill Publishing 1996 .<br /> xii, 330 p. , Vol: 1 ; 24 cm. .<br /> 0074600265 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=2950">Place hold on <em>Workshop technology </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=2950</guid> </item> <item> <title> Principles of electronic materials and devices </title> <dc:identifier>ISBN:0070607966 (hb) | 0072957913 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=3030</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0070607966.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Kasap, S. O..<br /> New Delhi McGraw-Hill 2006 .<br /> xiii, 874 p. ; 25 cm..<br /> 0070607966 (hb) | 0072957913 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=3030">Place hold on <em>Principles of electronic materials and devices</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=3030</guid> </item> <item> <title> Concise handbook of civil engineering </title> <dc:identifier>ISBN:</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=3449</link> <description> <![CDATA[ <p> By Vazirani, V. N. | S. P. Chandola.<br /> New Delhi S. Chand and Company Ltd. 1993 .<br /> iv, 984 , Includes index ; 25 cm..<br /> </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=3449">Place hold on <em>Concise handbook of civil engineering</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=3449</guid> </item> <item> <title> Advances in material science for engineering students </title> <dc:identifier>ISBN:</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=4577</link> <description> <![CDATA[ <p> By Dogra, R. K. | Sharma, A. K..<br /> Delhi S. K. Kataria and Sons 2000 .<br /> xvi, 688 p. ; 23 cm..<br /> </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=4577">Place hold on <em>Advances in material science</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=4577</guid> </item> <item> <title> Advanced materials - 95 processing of the 4th international symposium on advanced materials, 17-21st September, 1995, islamabad, Pakistan </title> <dc:identifier>ISBN:9698122044 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=4582</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9698122044.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Anwar ul Haq (editor).<br /> Kahuta Dr, A. Q, Khan Research Laboratories 1996 .<br /> ix, 697 p. ; 25 cm..<br /> 9698122044 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=4582">Place hold on <em>Advanced materials - 95</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=4582</guid> </item> <item> <title> Introduction to engineering materials </title> <dc:identifier>ISBN:0333150171 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=5103</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0333150171.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By John,V. B..<br /> s.n s.l .<br /> xii, 276 p. ; 23 cm..<br /> 0333150171 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=5103">Place hold on <em>Introduction to engineering materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=5103</guid> </item> <item> <title> Introduction to engineering materials </title> <dc:identifier>ISBN:007451505 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=5160</link> <description> <![CDATA[ <p> By Agrawal, B. K..<br /> New Delhi Tata MacGraw Hill 1988 .<br /> vii, 353 p. ; 23 cm..<br /> 007451505 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=5160">Place hold on <em>Introduction to engineering materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=5160</guid> </item> <item> <title> McGraw-Hill dictionary of engineering </title> <dc:identifier>ISBN:0070454124 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=5281</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0070454124.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Sybil P. Parker (editor).<br /> New York McGraw-Hill 1984 .<br /> 659 p. ; 24 cm..<br /> 0070454124 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=5281">Place hold on <em>McGraw-Hill dictionary of engineering</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=5281</guid> </item> <item> <title> Proceedings of 1st international conference on frontiers of advanced engineering materials (FAEM-04) </title> <dc:identifier>ISBN:(hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=6163</link> <description> <![CDATA[ <p> By Alam, Shahzad (editor) | Anwar ul Haq (editor).<br /> Lahore Ch. M. Boota Printers 2005 .<br /> x, 492 p. ; 27 cm..<br /> (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=6163">Place hold on <em>Proceedings of 1st international conference on frontiers of advanced engineering materials (FAEM-04)</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=6163</guid> </item> <item> <title> Engineering materials properties and applications of metals and alloys </title> <dc:identifier>ISBN:9788120324480 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=7705</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/812032448X.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Sharma, C.P..<br /> New Delhi PHI Learning 2010 .<br /> xiii, 258 p. , Includes index. ; 24 cm..<br /> 9788120324480 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=7705">Place hold on <em>Engineering materials</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=7705</guid> </item> <item> <title> Materials science and engineering </title> <dc:identifier>ISBN:9780470505861 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=8932</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0470505869.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Callister, William D. Jr. | David G. Rethwisch.<br /> Canada John Wiley &amp; Sons, Inc. 2011 .<br /> xx, 122 p. , Includes glossary and index. ; 24 cm..<br /> 9780470505861 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=8932">Place hold on <em>Materials science and engineering</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=8932</guid> </item> <item> <title> Engineering materials properties and selection </title> <dc:identifier>ISBN:9788120338340 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=11325</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8120338340.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Budinski, Kenneth G. | Michael K. Budinski.<br /> Delhi Prentice Hall 2010 .<br /> x, 774 p. , Includes bibliographical references and index. ; 29 cm..<br /> 9788120338340 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=11325">Place hold on <em>Engineering materials</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=11325</guid> </item> <item> <title> Electrical engineering materials and semiconductor devices </title> <dc:identifier>ISBN:8188458627 (pbk) | 9788188458622 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=13667</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8188458627.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Gupta, J.B..<br /> New Delhi S. K. Kataria &amp; sons 2009 .<br /> xi, 424 p. , Includes index. ; 24 cm..<br /> 8188458627 (pbk) | 9788188458622 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=13667">Place hold on <em>Electrical engineering materials and semiconductor devices</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=13667</guid> </item> <item> <title> Electrical engineering materials </title> <dc:identifier>ISBN:9781259006203 (pbk) | 1259006204 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=14112</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1259006204.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Shukla, R K | Archana Singh.<br /> New Delhi Tata McGraw-Hill 2012 .<br /> various pages ; 24 cm. .<br /> 9781259006203 (pbk) | 1259006204 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=14112">Place hold on <em>Electrical engineering materials</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=14112</guid> </item> <item> <title> Principles of electronic materials and devices </title> <dc:identifier>ISBN:9780070648203 (pbk) | 0070648204 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=15330</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0070648204.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Kasap, S. O..<br /> New Delhi McGraw-Hill Education (India) Pvt. Ltd. 2015 .<br /> xiii, 874 p. , Includes bibliographical references and index ; 24 cm..<br /> 9780070648203 (pbk) | 0070648204 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=15330">Place hold on <em>Principles of electronic materials and devices</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=15330</guid> </item> <item> <title> Concise handbook of electronics and electrical engineering </title> <dc:identifier>ISBN:8121923190-00 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=15342</link> <description> <![CDATA[ <p> By Khanna, V. K..<br /> New Delhi S. Chand &amp; Company Pvt. Ltd. 2014 .<br /> xvi, 703 p. , Includes index ; 24 cm..<br /> 8121923190-00 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=15342">Place hold on <em>Concise handbook of electronics and electrical engineering</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=15342</guid> </item> <item> <title> A course in electrical engineering materials </title> <dc:identifier>ISBN:9788131807040 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=15388</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8131807045.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Rajput, R. K..<br /> New Delhi University Science Press 2015 .<br /> xiii, 486 p. , Includes appendixes and index. ; 24 cm..<br /> 9788131807040 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=15388">Place hold on <em>A course in electrical engineering materials</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=15388</guid> </item> <item> <title> Strength of materials </title> <dc:identifier>ISBN:9788131759097 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=17981</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8131759091.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Jindal, U. C..<br /> New Delhi Pearson Education 2012 .<br /> xi, 864 p. , Includes index. ; 24 cm..<br /> 9788131759097 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=17981">Place hold on <em>Strength of materials</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=17981</guid> </item> <item> <title> Principles of electronic materials and devices </title> <dc:identifier>ISBN:9780071244589 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=19883</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0071244581.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Kasap, S. O..<br /> New York McGraw-Hill 2006 .<br /> xiii, 874 p. , Includes index. ; 25 cm..<br /> 9780071244589 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=19883">Place hold on <em>Principles of electronic materials and devices</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=19883</guid> </item> <item> <title> Elements of electrical engineering </title> <dc:identifier>ISBN:9789380386102 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=20882</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9380386109.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Banad, M. S. | M. N.Talawar.<br /> BAnglore University Science Press 2010 .<br /> 209 p. , Includes index. ; 24 cm..<br /> 9789380386102 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=20882">Place hold on <em>Elements of electrical engineering</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=20882</guid> </item> <item> <title> Electrical engineering materials </title> <dc:identifier>ISBN:9788188458486 (pbk) | 8188458481 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=21854</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8188458481.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Dogra, Rakesh.<br /> Delhi S.K. Kataria &amp; Sons 2012 .<br /> x, 338 p. , Includes index. ; 24 cm..<br /> 9788188458486 (pbk) | 8188458481 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=21854">Place hold on <em>Electrical engineering materials</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=21854</guid> </item> <item> <title> The science and engineering of materials </title> <dc:identifier>ISBN:9789386858153 (pbk) | 9386858150 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=24553</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9386858150.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Askeland, Donald R. | Wendelin J. Wright.<br /> Andover Cengage 2016 .<br /> xx, 870 p. , Includes appendix and index. ; 27 cm..<br /> 9789386858153 (pbk) | 9386858150 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=24553">Place hold on <em>The science and engineering of materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=24553</guid> </item> <item> <title> Engineering physics includes past question papers with solution </title> <dc:identifier>ISBN:9788125924098 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=26435</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8125924094.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Vijayakumari, G..<br /> Noida Vikas Publishing House 2014 .<br /> xv, 425 p. , Includes appendices. ; 22 cm..<br /> 9788125924098 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=26435">Place hold on <em>Engineering physics</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=26435</guid> </item> <item> <title> The science and engineering of materials </title> <dc:identifier>ISBN:9789386858153 (pbk) | 9386858150 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=28209</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9386858150.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Askeland, Donald R. | Wendelin J. Wright.<br /> Andover Cengage 2017 .<br /> xx, 870 p. , Includes appendix and index. ; 27 cm..<br /> 9789386858153 (pbk) | 9386858150 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=28209">Place hold on <em>The science and engineering of materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=28209</guid> </item> <item> <title> Engineering materials Polymers, ceramics and composites </title> <dc:identifier>ISBN:9788120346215 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=32059</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8120346211.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Bhargava, A. K..<br /> New delhi PHI learning private limited 2013 .<br /> xxii, 420 p. , Includes appendix, bibliography and index. ; 24 cm..<br /> 9788120346215 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=32059">Place hold on <em>Engineering materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=32059</guid> </item> <item> <title> Advanced mechanics of solids a gentle introduction </title> <dc:identifier>ISBN:</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=32074</link> <description> <![CDATA[ <p> By Nambudiripad, K. B. M..<br /> India Narosa 2018 .<br /> ix, Various pages. , Includes Index. ; 24 cm..<br /> </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=32074">Place hold on <em>Advanced mechanics of solids</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=32074</guid> </item> <item> <title> Advanced mechanics of solids a gentle introduction </title> <dc:identifier>ISBN:9788184876123 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=32076</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/8184876122.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Nambudiripad, K. B. M..<br /> India Narosa 2018 .<br /> ix, Various pages. , Includes Index. ; 24 cm..<br /> 9788184876123 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=32076">Place hold on <em>Advanced mechanics of solids</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=32076</guid> </item> <item> <title> Principles of electronic materials &amp; devices </title> <dc:identifier>ISBN:9780078028182 (hb)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=43327</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0078028183.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Kasap, S. O..<br /> New York McGraw-Hill 2018 .<br /> xiv, 978 p. , Includes appendix, index and table. ; 23 cm..<br /> 9780078028182 (hb) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=43327">Place hold on <em>Principles of electronic materials &amp; devices</em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=43327</guid> </item> <item> <title> The science and engineering of materials </title> <dc:identifier>ISBN:9789386858153 (pbk) | 9386858150 (pbk)</dc:identifier> <link>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=63238</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9386858150.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Askeland, Donald R. | Wendelin J. Wright.<br /> Andover Cengage 2017 .<br /> xx, 870 p. , Includes appendix and index. ; 27 cm..<br /> 9789386858153 (pbk) | 9386858150 (pbk) </p> ]]> <![CDATA[ <p> <a href="https://catalog.riphah.edu.pk//cgi-bin/koha/opac-reserve.pl?biblionumber=63238">Place hold on <em>The science and engineering of materials </em></a> </p> ]]> </description> <guid>https://catalog.riphah.edu.pk//cgi-bin/koha/opac-detail.pl?biblionumber=63238</guid> </item> </channel> </rss>
