Area array packing materials
Ken Gilleo (editor)
Area array packing materials Adhesives, pastes and lead-free - New York McGraw-Hill 2004 - viii, 166 p. : ill. ; 24 cm.
Includes index.
0071428283 (hb)
Electronic packaging--Polymer packing materials --Hermetic packaging systems --Flip chip processes --Microelectronic packing --Microstructure --FEAS
621.381046 / ARE
Area array packing materials Adhesives, pastes and lead-free - New York McGraw-Hill 2004 - viii, 166 p. : ill. ; 24 cm.
Includes index.
0071428283 (hb)
Electronic packaging--Polymer packing materials --Hermetic packaging systems --Flip chip processes --Microelectronic packing --Microstructure --FEAS
621.381046 / ARE