Microvias (Record no. 5038)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00536cam a22001334a 4500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 0071363270 |
| 082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381046 |
| Author Mark | LAU |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Authorship | Lau, John H. |
| -- | S.W. Ricky Lee |
| 245 10 - TITLE STATEMENT | |
| Title | Microvias |
| Sub Title | for low-cost, high-density interconnects |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | New York |
| Name of publisher | McGraw-Hill |
| Date of publication | 2001 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | xxiii, 565 p. |
| Illustrations | : ill. |
| Dimensions | ; 24 cm. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Subject | Microelectronic packaging. |
| -- | Technology |
| Keywords | Integrated circuits |
| -- | Semiconductors |
| -- | Printed circuits. |
| -- | Microvias |
| -- | Circuit board technology |
| -- | Microvia by etching |
| -- | Conductive paste |
| -- | FEAS |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| item type | Books |
| Withdrawn status | Lost status | Damaged status | Not for loan | Home library | Current library | Source of acquisition | Cost, normal purchase price | Full call number | Barcode | Copy number | Koha item type | Public note |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NOT for LOAN | Main Campus | Main Campus | Purchased: Star Books | 7169.44 | 621.381046 LAU | 4201 | 1 | Books | Reference: |