2nd 1998 IEMT/IMC symposium April 15-17,1998 Sonic-City-Omiya, Tokyo, Japan
Material type:
TextPublication details: Japan IEEE CPMTC 1998Description: xvii, 391 p. : ill. ; 28 cmISBN: - 0780350901 (pbk)
- 621.381046 IEE
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|
Books
|
Main Campus | 621.381046 IEE (Browse shelf(Opens below)) | 1 | Available | 3763 |
Browsing Main Campus shelves Close shelf browser (Hides shelf browser)
|
|
|
|
|
|
|
||
| 621.381045 OPT Optoelectronic devices | 621.381046 ARE Area array packing materials | 621.381046 ARE Area array packing materials | 621.381046 IEE 2nd 1998 IEMT/IMC symposium | 621.381046 INT Integrated circuit, hybrid, and multichip module package design guidelines | 621.381046 LAU Microvias | 621.381046 PRO Proceedings of the 1997 1st electronic packaging technology conference |
There are no comments on this title.
Log in to your account to post a comment.