Ken Gilleo (editor) <br/><br/>
Area array packing materials   Adhesives, pastes and lead-free 

 - New York   McGraw-Hill   2004 
 - viii, 166 p.  : ill.  ; 24 cm. 
<br/><br/> Includes index. 
<br/><br/><label>ISBN: </label>0071428283 (hb) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Polymer packing materials --Hermetic packaging systems --Flip chip processes --Microelectronic packing --Microstructure --FEAS 
<br/><br/><label>Dewey Class. No.: </label>621.381046  / ARE