TY  - BOOK
AU  - Ken Gilleo (editor)
TI  - Area array packing materials : Adhesives, pastes and lead-free
SN  - 0071428283 (hb)
U1  - 621.381046 
PY  - 2004///
CY  - New York 
PB  - McGraw-Hill 
KW  - Electronic packaging
KW  - Polymer packing materials
KW  - Hermetic packaging systems
KW  - Flip chip processes
KW  - Microelectronic packing
KW  - Microstructure
KW  - FEAS
N1  - Includes index
ER  -