April 15-17,1998 Sonic-City-Omiya, Tokyo, Japan IEEE CPMT creator text Japan IEEE CPMTC 1998 monographic xvii, 391 p. : ill. ; 28 cm. Electronic packaging Microelectronic technology Interconnect technology Packing technology Thermal management Microelectronics FEAS 621.381046 IEE 0780350901 (pbk)