Andrew A.O. TAY  LIM Thiam Beng <br/><br/>
Proceedings of the 1997 1st electronic packaging technology conference 

 - New York  Institute of Electrical and Electronics Engineers  1997 
 - 319 p.  : ill.  ; 30 cm. 
<br/><br/> "IEEE catalog no. 97TH8307"--Cover. 
<br/><br/><label>ISBN: </label>0780341570 (pbk) 0780341589 (pbk) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Flip chip technology--Thermal management--Electronics cooling--Interfacial adhesion--Microelectronics--FEAS
<br/><br/><label>Dewey Class. No.: </label>621.381046  / PRO