00580cam a2200133 a 4500020002100000020002100021082002000042100003600062245007500098260007000173300002900243500004000272650013400312  a0780341570 (pbk)  a0780341589 (pbk)00a621.381046bPRO  aAndrew A.O. TAYaLIM Thiam Beng10aProceedings of the 1997 1st electronic packaging technology conference  aNew YorkbInstitute of Electrical and Electronics Engineersc1997  a319 p.b: ill.c; 30 cm.  a"IEEE catalog no. 97TH8307"--Cover. 0aElectronic packagingvFlip chip technologyvThermal managementvElectronics coolingvInterfacial adhesionvMicroelectronicsvFEAS