TY  - BOOK
AU  - Andrew A.O. TAY
TI  - Proceedings of the 1997 1st electronic packaging technology conference
SN  - 0780341570 (pbk)
U1  - 621.381046 
PY  - 1997///
CY  - New York
PB  - Institute of Electrical and Electronics Engineers
KW  - Electronic packaging
KW  - Flip chip technology
KW  - Thermal management
KW  - Electronics cooling
KW  - Interfacial adhesion
KW  - Microelectronics
KW  - FEAS
N1  - "IEEE catalog no. 97TH8307"--Cover
ER  -