Michael Pecht (editor) <br/><br/>
Integrated circuit, hybrid, and multichip module package design guidelines  a focus on reliability 

 - New York  John Wiley & Sons, Inc.  1994 
 - xxxi, 426 p.  : ill.  ; 24 cm. 
<br/><br/> Includes index. 
<br/><br/><label>ISBN: </label>0471594466 (hb) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging<br/>Hybrid integrated circuits--Multichip modules--Reliability concepts--Wire and wirebonds--Design process--Lead seals--FEAS
<br/><br/><label>Dewey Class. No.: </label>621.381046  / INT