00539pam a2200121 a 4500020002000000082002000020100002700040245010300067260004400170300003500214500002000249650014800269  a0471594466 (hb)00a621.381046bINT  aMichael Pecht (editor)00aIntegrated circuit, hybrid, and multichip module package design guidelinesba focus on reliability  aNew YorkbJohn Wiley & Sons, Inc.c1994  axxxi, 426 p.b: ill.c; 24 cm.  aIncludes index. 0aElectronic packagingaHybrid integrated circuitsvMultichip modulesvReliability conceptsvWire and wirebondsvDesign processvLead sealsvFEAS