Integrated circuit, hybrid, and multichip module package design guidelines

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Michael Pecht (editor) creator text New York John Wiley & Sons, Inc. 1994 monographic xxxi, 426 p. : ill. ; 24 cm. Includes index. Electronic packaging Hybrid integrated circuits Multichip modules Reliability concepts Wire and wirebonds Design process Lead seals FEAS 621.381046 INT 0471594466 (hb)