00730pam a2200157 a 4500952013300000999001500133020002000148082002000168100002700188245010300215260004400318300003500362500002000397650014800417942000700565  00104071aRIUbRIUd2012-07-30ePurchasedg190.00l0o621.381046 INTp1399r2012-07-30 00:00:00t1w2019-02-21yBKzReference:  c3042d3042  a0471594466 (hb)00a621.381046bINT  aMichael Pecht (editor)00aIntegrated circuit, hybrid, and multichip module package design guidelinesba focus on reliability  aNew YorkbJohn Wiley & Sons, Inc.c1994  axxxi, 426 p.b: ill.c; 24 cm.  aIncludes index. 0aElectronic packagingaHybrid integrated circuitsvMultichip modulesvReliability conceptsvWire and wirebondsvDesign processvLead sealsvFEAS  cBK