Lau, John H.  S.W. Ricky Lee <br/><br/>
Microvias   for low-cost, high-density interconnects  

 - New York   McGraw-Hill  2001 
 - xxiii, 565 p.   : ill.   ; 24 cm. 
<br/><br/><label>ISBN: </label>0071363270 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging.<br/>Technology --Integrated circuits--Semiconductors--Printed circuits.--Microvias--Circuit board technology--Microvia by etching--Conductive paste--FEAS 
<br/><br/><label>Dewey Class. No.: </label>621.381046  / LAU