TY  - BOOK
AU  - Lau,John H.
TI  - Microvias : for low-cost, high-density interconnects 
SN  - 0071363270
U1  - 621.381046 
PY  - 2001///
CY  - New York 
PB  - McGraw-Hill
KW  - Microelectronic packaging
KW  - Technology
KW  - Integrated circuits
KW  - Semiconductors
KW  - Printed circuits
KW  - Microvias
KW  - Circuit board technology
KW  - Microvia by etching
KW  - Conductive paste
KW  - FEAS
ER  -