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	1.	Area array packing materials Adhesives, pastes and lead-free by Ken Gilleo (editor) Material type: Text Publication details: New York McGraw-Hill 2004 Availability: Items available for loan: Main Campus (2)Call number: 621.381046 ARE , ... Lists: FEAS G-Books July 2026. Place hold Save to lists Add to cart (remove)
	2.	2nd 1998 IEMT/IMC symposium April 15-17,1998 Sonic-City-Omiya, Tokyo, Japan by IEEE CPMT Material type: Text Publication details: Japan IEEE CPMTC 1998 Availability: Items available for loan: Main Campus (1)Call number: 621.381046 IEE. Lists: FEAS G-Books July 2026. Place hold Save to lists Add to cart (remove)
	3.	Proceedings of the 1997 1st electronic packaging technology conference by Andrew A.O. TAY LIM Thiam Beng Material type: Text Publication details: New York Institute of Electrical and Electronics Engineers 1997 Availability: Items available for loan: Main Campus (1)Call number: 621.381046 PRO. Lists: FEAS G-Books July 2026. Place hold Save to lists Add to cart (remove)
	4.	Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability by Michael Pecht (editor) Material type: Text Publication details: New York John Wiley & Sons, Inc. 1994 Availability: Items available for reference: Main Campus: NOT for LOAN (1)Call number: 621.381046 INT. Lists: FEAS G-Books July 2026. Save to lists Add to cart (remove)

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