000			00542nam a22001457a 4500
999			_c2979 _d2979
020			_a0071428283 (hb)
082			_a621.381046 _bARE
100			_aKen Gilleo (editor)
245			_aArea array packing materials _bAdhesives, pastes and lead-free
260			_aNew York _bMcGraw-Hill _c2004
300			_aviii, 166 p. _b: ill. _c; 24 cm.
500			_aIncludes index.
650			_aElectronic packaging _vPolymer packing materials _vHermetic packaging systems _vFlip chip processes _vMicroelectronic packing _vMicrostructure _vFEAS
942			_cBK