| 000 | 00532nam a22001457a 4500 | ||
|---|---|---|---|
| 999 |
_c2986 _d2986 |
||
| 020 | _a0780350901 (pbk) | ||
| 082 |
_a621.381046 _bIEE |
||
| 100 | _aIEEE CPMT | ||
| 245 |
_a2nd 1998 IEMT/IMC symposium _bApril 15-17,1998 Sonic-City-Omiya, Tokyo, Japan |
||
| 260 |
_aJapan _bIEEE CPMTC _c1998 |
||
| 300 |
_axvii, 391 p. _b: ill. _c; 28 cm. |
||
| 650 |
_aElectronic packaging _aMicroelectronic technology _vInterconnect technology _vPacking technology _vThermal management _vMicroelectronics _vFEAS |
||
| 942 | _cBK | ||