000			00585pam a2200145 a 4500
999			_c3042 _d3042
020			_a0471594466 (hb)
082	0	0	_a621.381046 _bINT
100			_aMichael Pecht (editor)
245	0	0	_aIntegrated circuit, hybrid, and multichip module package design guidelines _ba focus on reliability
260			_aNew York _bJohn Wiley & Sons, Inc. _c1994
300			_axxxi, 426 p. _b: ill. _c; 24 cm.
500			_aIncludes index.
650		0	_aElectronic packaging _aHybrid integrated circuits _vMultichip modules _vReliability concepts _vWire and wirebonds _vDesign process _vLead seals _vFEAS
942			_cBK