Proceedings of the 1997 1st electronic packaging technology conference
Andrew A.O. TAY LIM Thiam Beng
Proceedings of the 1997 1st electronic packaging technology conference - New York Institute of Electrical and Electronics Engineers 1997 - 319 p. : ill. ; 30 cm.
"IEEE catalog no. 97TH8307"--Cover.
0780341570 (pbk) 0780341589 (pbk)
Electronic packaging--Flip chip technology--Thermal management--Electronics cooling--Interfacial adhesion--Microelectronics--FEAS
621.381046 / PRO
Proceedings of the 1997 1st electronic packaging technology conference - New York Institute of Electrical and Electronics Engineers 1997 - 319 p. : ill. ; 30 cm.
"IEEE catalog no. 97TH8307"--Cover.
0780341570 (pbk) 0780341589 (pbk)
Electronic packaging--Flip chip technology--Thermal management--Electronics cooling--Interfacial adhesion--Microelectronics--FEAS
621.381046 / PRO