Proceedings of the 1997 1st electronic packaging technology conference (Record no. 3023)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00626cam a2200157 a 4500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 0780341570 (pbk) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 0780341589 (pbk) |
| 082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381046 |
| Author Mark | PRO |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Authorship | Andrew A.O. TAY |
| -- | LIM Thiam Beng |
| 245 10 - TITLE STATEMENT | |
| Title | Proceedings of the 1997 1st electronic packaging technology conference |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | New York |
| Name of publisher | Institute of Electrical and Electronics Engineers |
| Date of publication | 1997 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 319 p. |
| Illustrations | : ill. |
| Dimensions | ; 30 cm. |
| 500 ## - GENERAL NOTE | |
| General note | "IEEE catalog no. 97TH8307"--Cover. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Subject | Electronic packaging |
| Keywords | Flip chip technology |
| -- | Thermal management |
| -- | Electronics cooling |
| -- | Interfacial adhesion |
| -- | Microelectronics |
| -- | FEAS |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| item type | Books |
| Withdrawn status | Lost status | Damaged status | Not for loan | Home library | Current library | Source of acquisition | Full call number | Barcode | Koha item type |
|---|---|---|---|---|---|---|---|---|---|
| Main Campus | Main Campus | Purchased: Asia Foundation | 621.381046 PRO | 3689 | Books |