Integrated circuit, hybrid, and multichip module package design guidelines
Michael Pecht (editor)
Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability - New York John Wiley & Sons, Inc. 1994 - xxxi, 426 p. : ill. ; 24 cm.
Includes index.
0471594466 (hb)
Electronic packaging
Hybrid integrated circuits--Multichip modules--Reliability concepts--Wire and wirebonds--Design process--Lead seals--FEAS
621.381046 / INT
Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability - New York John Wiley & Sons, Inc. 1994 - xxxi, 426 p. : ill. ; 24 cm.
Includes index.
0471594466 (hb)
Electronic packaging
Hybrid integrated circuits--Multichip modules--Reliability concepts--Wire and wirebonds--Design process--Lead seals--FEAS
621.381046 / INT