Integrated circuit, hybrid, and multichip module package design guidelines (Record no. 3042)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 00585pam a2200145 a 4500 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| ISBN | 0471594466 (hb) |
| 082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381046 |
| Author Mark | INT |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Authorship | Michael Pecht (editor) |
| 245 00 - TITLE STATEMENT | |
| Title | Integrated circuit, hybrid, and multichip module package design guidelines |
| Sub Title | a focus on reliability |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication | New York |
| Name of publisher | John Wiley & Sons, Inc. |
| Date of publication | 1994 |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | xxxi, 426 p. |
| Illustrations | : ill. |
| Dimensions | ; 24 cm. |
| 500 ## - GENERAL NOTE | |
| General note | Includes index. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Subject | Electronic packaging |
| -- | Hybrid integrated circuits |
| Keywords | Multichip modules |
| -- | Reliability concepts |
| -- | Wire and wirebonds |
| -- | Design process |
| -- | Lead seals |
| -- | FEAS |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| item type | Books |
| Withdrawn status | Lost status | Damaged status | Not for loan | Home library | Current library | Source of acquisition | Cost, normal purchase price | Full call number | Barcode | Copy number | Koha item type | Public note |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NOT for LOAN | Main Campus | Main Campus | Purchased | 190.00 | 621.381046 INT | 1399 | 1 | Books | Reference: |