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Proceedings of the 1997 1st electronic packaging technology conference
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TextPublication details: New York Institute of Electrical and Electronics Engineers 1997Description: 319 p. : ill. ; 30 cmISBN: - 0780341570 (pbk)
- 0780341589 (pbk)
- 621.381046 PRO
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Main Campus | 621.381046 PRO (Browse shelf(Opens below)) | Available | 3689 |
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| 621.381046 IEE 2nd 1998 IEMT/IMC symposium | 621.381046 INT Integrated circuit, hybrid, and multichip module package design guidelines | 621.381046 LAU Microvias | 621.381046 PRO Proceedings of the 1997 1st electronic packaging technology conference | 621.381076 CAT 2000 solved problems in electronics | 621.381092 CAR Electromagnetism for electronic engineers | 621.38124 CHE Substrate integrated antennas and arrays |
"IEEE catalog no. 97TH8307"--Cover.
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