Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

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Material type: Text

TextPublication details: New York John Wiley & Sons, Inc. 1994Description: xxxi, 426 p. : ill. ; 24 cmISBN:

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List(s) this item appears in: FEAS G-Books July 2026

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Holdings
Item type	Current library	Call number	Copy number	Status	Notes	Date due	Barcode
Books	Main Campus	621.381046 INT (Browse shelf(Opens below))	1	NOT for LOAN	Reference:		1399

Includes index.

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